| 发明名称 |
STRAIN REDUCED STRUCTURE FOR IC PACKAGING |
| 摘要 |
A semiconductor device includes a semiconductor die having first and second conductive pads, and a substrate having third and fourth bonding pads. A width ratio of the first conductive pad over the third bonding pad at an inner region is different from a width ratio of the second conductive pad over the fourth bonding pad at an outer region.
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| 申请公布号 |
US2013270698(A1) |
申请公布日期 |
2013.10.17 |
| 申请号 |
US201213448217 |
申请日期 |
2012.04.16 |
| 申请人 |
CHEN HSIEN-WEI;CHEN YING-JU;YU TSUNG-YUAN;CHEN YU-FENG;WANG TSUNG-DING;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHEN HSIEN-WEI;CHEN YING-JU;YU TSUNG-YUAN;CHEN YU-FENG;WANG TSUNG-DING |
| 分类号 |
H01L23/488;H01L21/28 |
主分类号 |
H01L23/488 |
| 代理机构 |
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