| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board, which is capable of forming a resist pattern and a metal layer on a substrate by a small number of steps and is capable of reducing the amount of waste of a resist material.SOLUTION: The present invention relates to the method for manufacturing a printed wiring board having a resist pattern and a metal plating layer. The method for manufacturing a printed wiring board 1 according to the present invention comprises the steps of: partially applying a first resist material onto a substrate 2 to partially form first resist layers 3 as a resist pattern; and partially forming metal plating layers 4 so that they are arranged between the first resist layers 3 partially formed on the substrate 2. |
