| 发明名称 |
Microelectronic packages having cavities for receiving microelectronic elements |
| 摘要 |
Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts.
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| 申请公布号 |
US8541873(B2) |
申请公布日期 |
2013.09.24 |
| 申请号 |
US201113205162 |
申请日期 |
2011.08.08 |
| 申请人 |
MOHAMMED ILYAS;HABA BELGACEM;ZOHNI WAEL;OSBORN PHILIP R.;TESSERA, INC. |
发明人 |
MOHAMMED ILYAS;HABA BELGACEM;ZOHNI WAEL;OSBORN PHILIP R. |
| 分类号 |
H01L23/522;H01L23/498 |
主分类号 |
H01L23/522 |
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