| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized electronic component module of the same size as electronic components mounted on a substrate, and configuring a module upper surface; and a manufacturing method and a manufacturing device of the same.SOLUTION: A substrate smaller than the size of an electronic component configuring a module upper surface is used. A package of the electronic component mounted on the substrate has a BGA structure, and a position of a solder ball of the BGA structure is disposed on the inner side than the outline of the electronic component. In an aggregate substrate state, when cut into individual pieces, the substrate is cut from an opposite surface of a mounting surface of the electronic component. By using a space (a clearance) for the solder ball between the electronic component with the BGA structure mounted on the substrate and the substrate, only the substrate is cut. The cutting is carried out twice separately. |
