COMPOSITION, ABRASIVE PAD, AND METHOD FOR PRODUCING COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a composition having a high rate of elongation, a method for producing the same, and an abrasive pad which provides less defects on a wafer surface, and has a further extended pad life.SOLUTION: A composition includes a polymer obtained by polymerizing an ethylenic unsaturated compound and a polyurethane, and includes a compound having isocyanurate group as the ethylenic unsaturated compound.