| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a lead frame capable of improving adhesion of sealing resin provided on a rear surface of a die pad.SOLUTION: A method of manufacturing a lead frame includes a step of forming a square-like first dimple D1, on the rear surface of a die pad 10, which is equipped with a first inclined side face S1 inclining in depth direction on one facing two sides and an upright side surface VS standing in depth direction on the other facing two sides, and a step in which, by a second press working, in order that a second inclined side face S2 of a second dimple D2 equipped with the second inclined side face S2 inclining in depth direction is disposed in a lateral region of the upright side surface VS of the first dimple D1, the dimple D2 is formed on the rear surface of the die pad 10, making the upright side surface VS of the first dimple D1 becoming an invert inclined side face Sx inclining in the direction opposite to the first inclined side face S1. The surface of the die pad is a semiconductor element mounting surface. |
