发明名称 |
CUTTING METHOD FOR DEVICE WAFER |
摘要 |
A cutting method for cutting a device wafer along a plurality of crossing division lines by using a cutting blade, the division lines being formed on the front side of the device wafer to partition a plurality of regions where a plurality of devices are respectively formed. The cutting method includes a hydrophilic property providing step of applying a plasma to the front side of the device wafer to thereby make hydrophilic the front side of the device wafer, and a cutting step of cutting the device wafer along the division lines by using the cutting blade as supplying a cutting fluid to the device wafer after performing the hydrophilic property providing step.
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申请公布号 |
US2013203237(A1) |
申请公布日期 |
2013.08.08 |
申请号 |
US201313754386 |
申请日期 |
2013.01.30 |
申请人 |
DISCO CORPORATION;DISCO CORPORATION |
发明人 |
YAMAGUCHI AKIRA;DAII TOSHIHARU;IKEDA SHIGEYUKI |
分类号 |
H01L21/78 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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