PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A package substrate and a method for manufacturing the same are provided to form a cavity structure by applying a process of bonding a carrier substrate using a conductive bump and to simplify a package substrate fabrication process. CONSTITUTION: A first carrier substrate including a first circuit pattern layer (162) and a second carrier substrate including a second circuit pattern layer (164) are formed. The first carrier substrate, an insulating layer substrate (180), and the second carrier substrate are bonded. The first carrier substrate and the second carrier substrate are delaminated from the insulating layer substrate. A cavity (1220) for partly exposing the second circuit pattern layer is formed in the insulating layer substrate. A semiconductor chip (1310) is in the cavity.