| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a dicing frame from coming off from a dicing tape when a wafer is spun. <P>SOLUTION: A retainer 10 includes: a holding base 13 which rotates holding the wafer 20; a pendulum which holds a dicing frame 22 with centrifugal force generated by rotating the holding base 13; and a guard pin 12 provided so as to protrude from a position at the outer side of the dicing frame 22 in a direction that is different from the surface direction of the wafer 20. <P>COPYRIGHT: (C)2013,JPO&INPIT |
