| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive material which makes cracks less likely to occur in a solder part and also makes connection resistance between electrodes less likely to increase even when electrodes are electrically connected to obtain a connection structure and the obtained connection structure is subject to high temperature and high humidity. <P>SOLUTION: An anisotropic conductive material according to this invention includes: a binder resin; first conductive particles; and second particles. The first conductive particle has a base material particle and a conductive layer disposed on a surface of the base material particle, and at least an outer surface of the conductive layer is a solder layer. The base material particle is a metal particle having a melting point of 400°C or higher or a resin particle having a softening point of 260°C or higher. <P>COPYRIGHT: (C)2013,JPO&INPIT |
