发明名称 WAFER SCALE IMAGE SENSOR PACKAGE AND OPTICAL MECHANISM INCLUDING THE SAME
摘要 There is provided an optical mechanism including a substrate, an image sensor chip, a light source, a blocking member and a securing member. The image sensor chip is attached to the substrate and has an active area. The light source is attached to the substrate. The blocking member covers the image sensor chip and has an opening to expose at least the active area of the image sensor chip. The securing member fits on the blocking member to secure the blocking member to the substrate.
申请公布号 US2013147000(A1) 申请公布日期 2013.06.13
申请号 US201213675072 申请日期 2012.11.13
申请人 PIXART IMAGING INC.;PIXART IMAGING INC. 发明人 CHEN HUI-HSUAN;LIU TIEN-CHIA;YU CHIA-HSIN
分类号 H01L31/0232 主分类号 H01L31/0232
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