发明名称 |
DEVICES, SUBSTRATE DEVICES, MULTI-LAYERED SUBSTRATE DEVICES AND METHODS FOR FORMING SUBSTRATE DEVICES |
摘要 |
A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground. |
申请公布号 |
HK1148639(A1) |
申请公布日期 |
2013.06.07 |
申请号 |
HK20110102609 |
申请日期 |
2011.03.15 |
申请人 |
SHOCKING TECHNOLOGIES INC. |
发明人 |
KOSOWSKY, LEX;FLEMING, ROBERT;GRAYDON, BHRET |
分类号 |
H05K |
主分类号 |
H05K |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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