| 摘要 |
PURPOSE: A semiconductor test apparatus is provided to improve quality of a semiconductor device and throughput by resolving a mount failure issue. CONSTITUTION: A loading unit(110) includes a plurality of loading stackers(LS1-LS3), a transfer(120) and a loader(130). The transfer moves a custom tray loaded in the loading stackers to the loader. In the loader, a target test device accommodated in the custom tray(CT) is moved to a test tray and transferred to a soak chamber(140). The soak chamber is arranged to be adjacent to the loading unit and heats or cools the target test device received from the loading unit to predetermined temperature. A test chamber(150) connects a test unit to the target test device and performs the test. An exit chamber(160) is arranged to be adjacent to an unloading unit(190), cools or heats the target test device passed the test to the original state of room temperature. The unloading unit includes an unloader(170), a transfer(180), a plurality of unloading stackers(US1-US5) and et cetera. In the unloader, the target test device passed the test by being accommodated in the test tray is moved to the custom tray. The transfer loads the custom tray in which the target test device is accommodated to any one of the unloading stackers.
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