| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wire saw control system for moving a wire saw. <P>SOLUTION: This wire saw control system 1 of the wire saw 100 is provided for moving a wire 230 at a selectable wire speed to ingots 302, 304, 306 and 308 to slice them into wafers, and includes a camera 20 for inspecting the wire 230, and a camera control unit 25 for moving the camera 20 according to the wire speed. The wire saw 100 includes the wire saw control system 1. The method of inspecting the wire 230 of the wire saw 2 include a step of moving the wire 230 at a variable wire speed, and a step of inspecting the wire 230 according to the wire speed and obtaining an inspection result thereby. <P>COPYRIGHT: (C)2013,JPO&INPIT |
