发明名称 |
METHOD AND DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS USING A REDUCTION MATERIAL WHICH UNDERGOES A PHASE CHANGE |
摘要 |
The invention relates to a method for encapsulating electronic components mounted on a carrier, comprising the processing steps of: A) placing an electronic component for encapsulating into a mould cavity connecting to the carrier, B) filling the mould cavity with liquid encapsulating material, and C) at least partially curing the encapsulating material in the mould cavity A reduction material is introduced during processing step B). Said material undergoes a phase change during processing step B) whereby the volume of the reduction material decreases. The invention also relates to a device for applying this method.
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申请公布号 |
WO2013066162(A1) |
申请公布日期 |
2013.05.10 |
申请号 |
WO2012NL50724 |
申请日期 |
2012.10.18 |
申请人 |
FICO B.V. |
发明人 |
ZIJL, JOANNES LEONARDUS JURRIAN;GAL, WILHELMUS GERARDUS JOZEF |
分类号 |
B29C45/17;B29C45/02;B29C45/14;H01L21/56 |
主分类号 |
B29C45/17 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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