发明名称 SURFACE MOUNTING PASSIVE ELEMENT COMPONENT, COMPONENT CARRIER TAPE, WIRING BOARD WITH BUILT-IN COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To enhance the wiring density of a conducting path from the component terminal when located in the plate thickness. <P>SOLUTION: The surface mounting passive element component includes a rectangular parallelepiped element member, first terminal electrodes provided, respectively, on the first end face on one side of the element member in the longitudinal direction, and on a part of at least the upper and lower surfaces of the element member continuous to the first end face so as to be continuous thereto, and second terminal electrodes provided, respectively, on the second end face on the other side of the element member in the longitudinal direction, and on a part of at least the upper and lower surfaces of the element member continuous to the second end face so as to be continuous thereto. The area each of the first and second terminal electrodes provided on the upper surface of the element member is wider than the area of the terminal electrode provided on the lower surface of the element member. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013073989(A) 申请公布日期 2013.04.22
申请号 JP20110210173 申请日期 2011.09.27
申请人 DAINIPPON PRINTING CO LTD 发明人 SASAOKA KENJI
分类号 H01G4/252;B65D73/02;B65D85/86;H01C7/00;H01G4/232;H01G4/30;H05K3/46 主分类号 H01G4/252
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