发明名称 MANUFACTURING METHOD OF CONNECTION STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a connection structure which allows for accurate arrangement of conductive particles between electrodes while enhancing conduction reliability between electrodes. <P>SOLUTION: In the manufacturing method of a connection structure 1, an anisotropic conductive material layer is laminated by an anisotropic conductive material containing a curable component and conductive particles 5 on the surface 2a of a first connected member 2, by using the first connected member 2 having a first electrode 2b and an insulating film 2c, covering the first electrode 2b and provided with a plurality of openings X so as to expose the first electrode 2b partially. Thereafter, a second connected member 4 having a second electrode 4b on the surface 4a is laminated on the anisotropic conductive material layer, and a cured material layer 3 is formed by curing the anisotropic conductive material layer. Minimum melting viscosity of the anisotropic conductive material is 1000-10000 Pa s at 60-150&deg;C. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013055331(A) 申请公布日期 2013.03.21
申请号 JP20120173067 申请日期 2012.08.03
申请人 SEKISUI CHEM CO LTD 发明人 ISHIZAWA HIDEAKI
分类号 H01L21/60;H01R43/00 主分类号 H01L21/60
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