SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to protect an active layer by using a double molding layer. CONSTITUTION: A first semiconductor chip(100) is laminated on a package substrate. An inner solder ball(125) electrically connects the package substrate and the first semiconductor chip. A second semiconductor chip(200) is laminated on the first semiconductor chip. An upper molding layer(300) covers the first and the second semiconductor chip. A lower molding layer(130) is formed in the lower surface of the first semiconductor chip.