| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated sintered wiring board which has a low open failure rate and also excellent high temperature and high humidity reliability regardless of having a fine wiring layer. <P>SOLUTION: At least a part of an in-plane conductor is formed in a fine line and a cross-sectional shape of the in-plane conductor formed in the fine line is made in a trapezoid, and a height a of the trapezoidal cross section, a length c of the lower base, a length d of the upper base, and a space b between trapezoidal cross sectional lower bases of the in-plate conductor adjacent to each other in a plane parallel to the main surface of a substrate satisfy a specific relation. <P>COPYRIGHT: (C)2013,JPO&INPIT |
