| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive film that is used for a multilayer printed circuit board by the build-up method, has high adhesive strength, is hardly roughened by a desmearing treatment and hardly causes blister defects; a multilayer printed wiring board using the adhesive film; and a method for producing the multilayer printed wiring board. <P>SOLUTION: The adhesive film includes: a layer A comprising a resin composition containing components (a)-(d) blended in the following blending quantities, a layer B comprising a thermosetting resin composition that is solid at <40°C and melts at ≥40°C and <140°C and a layer C that is a substrate for supporting the layer A and the layers are arranged in the order of the layer C, the layer A and the layer B. The components (a)-(d) constituting the resin composition contained in the layer A. The component (a) is a resin to be dissolved in an organic solvent and one or more resins selected from a polyimide resin, polyamide-imide resin, polyamide resin, polyether imide resin and polybenzoxazole resin, the component (b) is a thermosetting resin, the component (c) is a filler and the component (d) is a phenoxy resin. The ratio of the mass of the component (a) to the mass of the component (b) is 1:0.5 to 1:50, the ratio of the total mass of the component (a) and the component (b) to the mass of the component (c) is 1:0.02 to 1:0.5, the ratio of the mass of the component (d) to the mass of the component (a) is 1:0.2 to 1:10 and the total blending quantity of the component (a) to the component (d) is ≥70 pts.mass based on 100 pts.mass of the resin composition. <P>COPYRIGHT: (C)2013,JPO&INPIT |
