| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a workload in destructing a silicon chip in a nonvolatile memory chip. <P>SOLUTION: This destructive device 1 includes a horn 12 transmitting ultrasonic vibration to the nonvolatile memory chip 2 and an AE sensor 14 detecting elastic waves which are generated when a mold resin 2B or the silicon chip 2A in the nonvolatile memory chip 2 is destructed by the ultrasonic vibration. The destructive device 1 includes an acquisition part 21 acquiring the response power of a harmonic content of a specific frequency band from a frequency response of the elastic waves and a first determination part 22 determining whether or not the obtained response power reaches a first threshold value X1 or smaller. The destructive device 1 includes a second determination part 23 determining whether or not the obtained response output reaches a second threshold value X2 or larger after the response output reaches the first threshold value or smaller. Furthermore, the destructive device 1 includes a control part 24 controlling the horn 12 to stop the output power of the ultrasonic vibration when the obtained response output reaches the second threshold value or larger. <P>COPYRIGHT: (C)2013,JPO&INPIT |
