发明名称 |
Head assembly for chip mounter |
摘要 |
A head assembly for a chip mounter is provided. The head assembly includes a nozzle module disposed above a printed circuit board (PCB) and configured to pick up and move an electronic component to mount the electronic component on the PCB, and a component recognition module electrically connected to the nozzle module and configured to recognize presence of the electronic component, a distance between the PCB and the nozzle module, and alignment of the electronic component at least one given moving position of the electronic component.
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申请公布号 |
US8359735(B2) |
申请公布日期 |
2013.01.29 |
申请号 |
US20100761603 |
申请日期 |
2010.04.16 |
申请人 |
SAMSUNG TECHWIN CO., LTD.;BAN JONG-EOK;KIM SEONG-KU |
发明人 |
BAN JONG-EOK;KIM SEONG-KU |
分类号 |
B23P19/00 |
主分类号 |
B23P19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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