SUBSTRATE PROCESSING DEVICE

摘要

The device is equipped with: a plurality of nozzles (120) for discharging a chemical liquid (10) onto a substrate; and a nozzle header (110) on the bottom wall (112) of which are individually positioned the plurality of nozzles (120) spaced apart from one another, the chemical liquid (10) being supplied to an interior region enclosed by peripheral walls which include the bottom wall (112). The device is further equipped with: a supply line (140) connected to a section other than the end of the nozzle header (110), for supplying the chemical liquid (10); and a large pipe portion (130) positioned at the ends of the nozzle header (110), and having an interior region traverse cross section expanded to a larger size than the nozzle header (110). The upper surface of the bottom wall (131) of the large pipe portion (130) is positioned below the upper surface of the bottom wall (112) of the nozzle header (110).