| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the throughput and dye use efficiency of dye adsorption processing for making a porous semiconductor layer on a substrate adsorb dye. <P>SOLUTION: A dye solution drip coating part 12 performs first processing (dye solution drip coating processing) for dripping and applying a dye solution on a porous semiconductor layer on an unprocessed substrate G having been carried in a dye adsorption device 10. A solvent vaporization and removal part 14 performs second processing (solvent removal processing) for vaporizing a solvent away from the dye solution applied on the semiconductor layer on the substrate G. A rinse part 16 performs third processing (rinse processing) for washing away unnecessary or excessive dye sticking on a surface of the semiconductor layer on the substrate G. A controller 20 controls operations of respective parts in the dye adsorption device and further controls a sequence of the whole device for carrying out the dye adsorption processing. <P>COPYRIGHT: (C)2013,JPO&INPIT |
