| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the connection reliability between lands of wiring boards in a manufacturing method of a multilayer circuit board where multiple wiring boards are bonded to each other with prepregs sandwiched therebetween. <P>SOLUTION: A manufacturing method of a multilayer circuit board has the steps of: forming a prepreg, having first holes reaching plating through holes and second holes reaching a mat pattern, on a surface of a first circuit board where the plating through holes and the mat pattern are formed; filling a conductive paste into the first holes; and pressurizing a second circuit board against the first circuit board through the prepreg. <P>COPYRIGHT: (C)2013,JPO&INPIT |
