| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a stacked-type semiconductor device capable of maintaining a gap between an upper semiconductor chip and a lower semiconductor chip and increasing connection intensity between the semiconductor chips before an underfill resin is filled therewith. <P>SOLUTION: A semiconductor device 1 according to an embodiment comprises a first semiconductor chip 2 and a second semiconductor chip 3 stacked on the first semiconductor chip 2. The first and second semiconductor chips 2, 3 are electrically connected via a bump connection body 6. A stopper projection 7 and an adhesive projection 8 are provided in at least one of the first and second semiconductor chips 2, 3. The stopper projection 7 contacts the other of the first and second semiconductor chips 2, 3 in a non-adhesion state. The adhesive projection 8 adheres to the first and second semiconductor chips 2, 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
