| 摘要 |
<p>A dispersion containing Cu ultrafine particles individually dispersed therein comprises an organic solvent which is hardly evaporated at room temperature, but can be evaporated during a drying-firing step upon forming Cu-distributing wires on a semiconductor substrate and metal Cu-containing ultrafine particles having a particle size of not greater than 0.01 mu m, in which the surface of the individual Cu ultrafine particles is surrounded by or covered with the organic solvent, these particles are independently dispersed in the solvent, and the dispersion has a viscosity of not higher than 50 cP at 20 DEG C. The individual Cu ultrafine particle dispersion permits the complete embedding or filling of, for instance, fine wiring grooves, via holes and contact holes of LSI substrates with a Cu-thin film and thus permits the formation of a conductive, uniform and fine pattern on a substrate.</p> |
