| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid-state imaging device of high quality. <P>SOLUTION: A solid-state imaging device 11 of the embodiment includes: a flexure guide 15 having a concave flexure section 28; a sensor substrate 14 which receives light condensed by a lens, includes a sensor section 18 generating a charge in accordance with a light reception amount on its surface, in which the flexure guide 15 is fixed to its rear face and a region including the sensor section 18 is curved in a convex shape along the flexure section 28 of the flexure guide 15; a first adhesive 16 formed around the sensor section 18 in the surface of the sensor substrate 14 so as to surround the sensor section 18; a tabular transparent substrate 17 fixed onto the sensor substrate 14 with the adhesive 16; and external electrodes 23 which are formed at the rear face of the sensor substrate 14 and are electrically connected to the sensor section 18 via through electrodes 25 arranged on the sensor substrate 14. <P>COPYRIGHT: (C)2013,JPO&INPIT |
