| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-frequency circuit module that allows efficient prevention of malfunction and characteristic degradation of an IC element caused by, for example, superimposing high-frequency noise occurring in an RF circuit on a power-supply line, without the need of using an additional shield case. <P>SOLUTION: A high-frequency circuit module includes: an IC element 4 for processing a high-frequency signal for wireless communication transmitted to and received from an antenna element 2; an RF circuit 3 for impedance matching with the antenna element 2; and a power-supply circuit 5 for supplying power to the IC element 4. The RF circuit 3 and the power-supply circuit 5 are provided with surface-mounted components 32 and 51, respectively, the RF circuit is provided with an inductor substrate 31 that uses a magnetic material substrate as an element body and includes a coil element therein, and the surface-mounted components 32 and 51 and the inductor substrate 31 are mounted on a surface of a core substrate 6. The inductor substrate 31 is provided between the surface-mounted component 32 constituting the RF circuit 3 and the surface-mounted component 51 constituting the power supply circuit 5. <P>COPYRIGHT: (C)2013,JPO&INPIT |
