SYSTEM AND METHOD IN MOUNTING OF IMAGE PICKUP DEVICE ON FLEXIBLE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To reduce an arrangement problem of an image pickup device in a digital camera module.

SOLUTION: The digital camera module 200 includes the image pickup device 204. The image pickup device is installed on a flexible circuit board 202. In the digital camera module, the image pickup device is directly installed on the flexible circuit board by using an adhesive. The circuit board having flexibility includes a flexible base layer, first and second conductive tracing layers formed on the flexible base layer, a plurality of first contact pads 224 for the image pickup device, and a connector 214. Each of the first contact pads consists of a layer formed of nickel bonded onto the first conductive tracing layer and a layer formed of gold bonded onto the layer formed of the nickel. Each of the first contact pads is connected to the connector in a state where the circuit board having the flexibility is bent.

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