发明名称 Hole first hardmask definition
摘要 A semiconductor device and a method of manufacture are provided, such as a MTJ device and a method of manufacturing a MTJ device. The MTJ device may include a bottom electrode, a MTJ stack, and a top electrode, wherein the top electrode is formed using a hole-filling technique. The top electrode may have slanted sidewalls. The MTJ stack may be formed by depositing corresponding MTJ layers. A patterned mask may be formed and patterned over the MTJ layers to form an opening defining the top electrode. The opening is filled with a conductive material to form the top electrode. The top electrode is then used as a mask to pattern the MTJ layers, thereby forming a MTJ stack.
申请公布号 US8313959(B1) 申请公布日期 2012.11.20
申请号 US201113211909 申请日期 2011.08.17
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 HUANG WEI-HANG;LIU SHIH-CHANG;HSU CHERN-YOW;SUNG FU-TING;TSAI CHIA-SHIUNG
分类号 H01L21/00 主分类号 H01L21/00
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