发明名称 Interpenetrating polymer network structure and polishing pad, and process for producing the same
摘要 The present invention relates to a process for producing an interpenetrating polymer network structure, which comprises the steps of impregnating a polymer molding with a radical polymerizable composition containing an ethylenically unsaturated compound and a radical polymerization initiator; and polymerizing the ethylenically unsaturated compound in a swollen state of the polymer molding impregnated with the radical polymerizable composition; wherein a chain transfer agent and/or a radical polymerization inhibitor are added to the radical polymerizable composition and/or the polymer molding before impregnating the polymer molding with the radical polymerizable composition. According to the present invention, a highly uniform interpenetrating polymer network structure can be obtained. The present invention also provides a polishing pad which is exhibits high in-plane uniformity of a polishing rate during polishing, and also has excellent flattening properties and improved pad lifetime during polishing, and a process for producing the same.
申请公布号 US8314192(B2) 申请公布日期 2012.11.20
申请号 US20090375371 申请日期 2009.01.27
申请人 TABATA NORIKAZU;HASHISAKA KAZUHIKO;SUGIMURA MASAHIRO;SAKAMOTO TAKUO;UE MASAKI;NAKAYAMA HIROYUKI;FUKUDA SEIJI;TORAY INDUSTRIES, INC. 发明人 TABATA NORIKAZU;HASHISAKA KAZUHIKO;SUGIMURA MASAHIRO;SAKAMOTO TAKUO;UE MASAKI;NAKAYAMA HIROYUKI;FUKUDA SEIJI
分类号 C08F2/00;B24B37/24 主分类号 C08F2/00
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