发明名称 |
Interpenetrating polymer network structure and polishing pad, and process for producing the same |
摘要 |
The present invention relates to a process for producing an interpenetrating polymer network structure, which comprises the steps of impregnating a polymer molding with a radical polymerizable composition containing an ethylenically unsaturated compound and a radical polymerization initiator; and polymerizing the ethylenically unsaturated compound in a swollen state of the polymer molding impregnated with the radical polymerizable composition; wherein a chain transfer agent and/or a radical polymerization inhibitor are added to the radical polymerizable composition and/or the polymer molding before impregnating the polymer molding with the radical polymerizable composition. According to the present invention, a highly uniform interpenetrating polymer network structure can be obtained. The present invention also provides a polishing pad which is exhibits high in-plane uniformity of a polishing rate during polishing, and also has excellent flattening properties and improved pad lifetime during polishing, and a process for producing the same. |
申请公布号 |
US8314192(B2) |
申请公布日期 |
2012.11.20 |
申请号 |
US20090375371 |
申请日期 |
2009.01.27 |
申请人 |
TABATA NORIKAZU;HASHISAKA KAZUHIKO;SUGIMURA MASAHIRO;SAKAMOTO TAKUO;UE MASAKI;NAKAYAMA HIROYUKI;FUKUDA SEIJI;TORAY INDUSTRIES, INC. |
发明人 |
TABATA NORIKAZU;HASHISAKA KAZUHIKO;SUGIMURA MASAHIRO;SAKAMOTO TAKUO;UE MASAKI;NAKAYAMA HIROYUKI;FUKUDA SEIJI |
分类号 |
C08F2/00;B24B37/24 |
主分类号 |
C08F2/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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