发明名称 |
METHODS OF IN-SITU MEASUREMENTS OF WAFER BOW |
摘要 |
Various embodiments describe a method of quantifying bow in a wafer. In one embodiment, the method includes measuring a first plurality of distances from a first sensor to a first surface of the wafer to calculate the bow in the wafer. The first sensor is positioned outside of a set of process modules of the plasma processing system. A determination is made whether the calculated bow of the wafer is within a pre-determined range. If the calculated bow of the wafer is within the pre-determined range, the wafer is moved into a process module of the set of process modules for processing and a recipe for processing the wafer is adjusted based on the calculated bow of the wafer. If the calculated bow of the wafer is outside the pre-determined range, the wafer is removed from the plasma processing system. Other methods are described as well. |
申请公布号 |
US2012283865(A1) |
申请公布日期 |
2012.11.08 |
申请号 |
US201213532097 |
申请日期 |
2012.06.25 |
申请人 |
BAILEY, III ANDREW D.;LAM RESEARCH CORPORATION |
发明人 |
BAILEY, III ANDREW D. |
分类号 |
H01L21/66;G05B19/19;G06F19/00;H01L21/677 |
主分类号 |
H01L21/66 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|