| 摘要 |
Testing assembly (A) for testing a singulated semiconductor die comprising a power component. The assembly comprises an current input connectable to a current source (5), for providing a current greater than 50 Amps to the power component; a signal output (60) connectable to a signal analyzer, for receiving signals representing a sensed parameter of the power component sensed when the current is provided; a first contact unit (1 ), adapted to support the semiconductor die (3); a second contact unit (2), movably mounted relative to the first contact unit; and at least an electrically-conductive resilient sheath (4), adapted to be sandwiched between the semiconductor die (3) and the second contact unit (2) when the second contact unit (2) is brought toward the semiconductor die (3) during a test, the sheath forming part of an electrical path from the current input through at least a part of the die when thus sandwiched.
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