Co-Si-BASED COPPER ALLOY SHEET

摘要

[Problem] To provide a Co-Si-based copper alloy sheet which has excellent solder wettability and undergoes the formation of fewer pinholes upon being soldered. [Solution] A Co-Si-based copper alloy sheet containing 0.5-3.0 mass% of Co and 0.1-1.0 mass% of Si, with the remainder being Cu and unavoidable impurities, wherein a requirement represented by the following formula is fulfilled: [60 degrees specular glossiness G in the direction parallel to the rolling direction (RD)] - [60 degrees specular glossiness G in direction transverse to rolling direction (TD)] = 90%.