| 摘要 |
<p>Provided are a method for forming copper wiring, a method for manufacturing a wiring substrate, and a wiring substrate, which are capable of improving the conductivity of the copper wiring and suppressing deterioration over time. The method for forming copper wiring includes: a wiring pattern forming step in which a wiring pattern is formed upon a substrate (10) using suspension (12) by providing the suspension (12), with copper particles (14) dispersed therein having an average particle size of at least 100 nm, upon the substrate (10); a drying step in which, after the wiring pattern forming step, the copper particles (14) in the wiring pattern are dried at a temperature lower than 150°C; a pressuring step in which, after the drying step, pressure is applied to the copper particles (14) in the wiring pattern; a heating step in which, after the pressuring step, the copper particles (14) in the wiring pattern are heated; and a reduction treatment step in which, after the heating step, the copper particles (14) in the wiring pattern are reduced.</p> |
