| 摘要 |
PURPOSE: A flip-chip magnetoresistance sensor package and a manufacturing method thereof are provided to reduce a distance to a measurement object, thereby improving the sensitivity of a magnetoresistance sensor without increasing the intensity of a magnetic field being applied from the outside. CONSTITUTION: A flip-chip magnetoresistance sensor package comprises a substrate(100), a magnetoresistance sensor unit(230), and an underfill(300). A first conductive pad is formed to transmit electrical signals on the top surface of the substrate. The magnetoresistance sensor unit is bonded on the substrate with a flip-chip, thereby being connected to the first conductive pad. An interval of the substrate and magnetoresistance sensor unit is filled with the underfill so that the underfill becomes hardened.
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