发明名称 |
MOLDED CHIP FABRICATION METHOD AND APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED with coating containing a conversion material which allows control of a geometry and a thickness of the coating so as to provide a uniform color temperature regardless of viewing angles as well as consistent reproduction of the same or similar light-emitting characteristics. <P>SOLUTION: An LED 102 comprises a plurality of semiconductor layers and a contact 104 at a top part which is in electrical contact with the semiconductor layers and extends upward from the semiconductor layers. Coating comprising a cured binder and a conversion material which covers and conforms to the semiconductor layers is applied onto the LED 102 to yield a coated LED 122. The contact extends upward through the coating and is exposed to the top surface of the coating for electrical contact. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012138587(A) |
申请公布日期 |
2012.07.19 |
申请号 |
JP20120026326 |
申请日期 |
2012.02.09 |
申请人 |
CREE INC |
发明人 |
MICHAEL S LEUNG;ERIC J TARSA;IBBETSON JAMES |
分类号 |
H01L33/50;H01L21/56;H01L33/54 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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