| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a grounding structure of a printed circuit board of communication equipment in which the printed circuit board arranged in communication equipment is not affected by electromagnetic waves by shielding the electromagnetic waves. <P>SOLUTION: A grounding structure 2 of a printed circuit board is applied to a printed circuit board 4, which is caused to contact to a grounded casing 6, to form a ground circuit that shields electromagnetic waves. It includes a copper conduction layer 8 provided at the peripheral edge of the printed circuit board 4, and a plurality of solder contact points 10 that are respectively provided on the copper conduction layer 8 to electrically contact to the casing 6. The solder contact points 10 are arranged zigzag on the copper conduction layer 8. The solder contact points 10 are semispherical. An OSP layer is additionally provided which is so applied on the copper conduction layer 8 as to expose the solder contact points 10. A soft conduction layer is further provided among the solder contact points, the OSP layer, and the casing, to be connected electrically to the solder contact points, the copper conduction layer, and the casing respectively. <P>COPYRIGHT: (C)2012,JPO&INPIT |
