SPUTTERING DEVICE AND SPUTTERING METHOD

摘要

The present invention achieves a sputtering device that can adjust the T/S distance without stopping the operation of the sputtering device. The sputtering device, which performs sputtering processing of a substrate (9) within a chamber (13), has: a cylindrical target (1) provided within the chamber (13); and a target support mechanism (6) that holds the cylindrical target (1) at a position that faces the substrate (9). The target support mechanism (6) has a support shaft (61) to one end of which the cylindrical target (1) is connected, and the support shaft (61), at the other end side thereof, is rotatably journaled in a manner so that the distance between the cylindrical target (1) and the substrate (9) is adjustable.