| 摘要 |
<p>PURPOSE: A wafer aligning device is provided to prevent a wafer from sliding by downwardly tilting the upper side of a chuck pad included in a rotating unit to suppress the influence of a centrifugal force. CONSTITUTION: A rotating unit(200) is mounted on the upper side of a housing(100). A chuck pad(220) is tilted from the end to the center of an end of a wing in the rotating unit. A receiving unit(300) is mounted on the upper side of the rotating unit. A detection sensor(400) is mounted on the bottom of the upper surface of the housing with a preset height. A cylinder(600) is mounted in the housing.</p> |
