| 摘要 |
PURPOSE: A solder coating device and a solder coating method using the same are provided to prevent solder from being excessively coated in a plug forming area by discharging the solder from the plug coating area of a substrate. CONSTITUTION: A solder palette(110) has an opening(112) which selectively exposes a plug forming area(16) of a substrate(10). A driver contacts solder with the plug forming area of the substrate and moves the solder palette in one direction. A solder inducing unit(120) arranges the solder palette near the opening and induces the solder in the other direction opposite to the one direction. The solder palette includes a first region(114) and a second region(116). The solder inducing unit defines the opening with the solder palette in the second region. |
