发明名称 Semiconductor device and manufacturing method thereof, and semiconductor substrate
摘要 <p>A semiconductor substrate is provided which includes a semiconductor substrate main body (62) which has an element forming layer (65) and a gettering layer (66) provided on an upper layer thereof; a device (64), each of which includes a first conductive type region, provided in the element forming layer (65); and a dielectric film (63) which is provided on an upper layer of the gettering layer (66) and which induces a second conductive type region in a surface of the gettering layer (66). </p>
申请公布号 EP2242116(A3) 申请公布日期 2012.06.13
申请号 EP20100172155 申请日期 2010.01.29
申请人 SONY CORPORATION 发明人 IWABUCHI, SHIN
分类号 H01L27/146;H01L21/322;H01L21/762 主分类号 H01L27/146
代理机构 代理人
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