| 摘要 |
A board-shaped heat dissipating device includes a board body having a plane face with a recess formed thereon, a heat conducting element fitted in the recess, at least one groove formed on any one of the board body and the heat conducting element, and at least one heat pipe pressed into the groove to flush with an open side of the groove. After the heat pipe is pressed into the groove and the heat conducting element is firmly fitted in the recess, portions of the heat conducting element that are higher than the plane face are removed through a cut operation, so that the heat conducting element is flush with the plane face of the board body to reduce the space occupied by the heat dissipating device. With the above arrangements, the problem of thermal resistance can be avoided and upgraded overall heat dissipation efficiency can be achieved.
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