发明名称 Method and apparatus for forming hole
摘要 In a method of forming a hole on a work piece, a laser beam is directed from a laser head to a predetermined portion of the work piece to form a pilot hole having a first surface condition, and then the predetermined portion of the work piece is punched using a die and a punch having a cross-section greater than a cross-section of the pilot hole. Thus, a finished hole having a cross-section greater than the cross-section of the pilot hole is formed over the pilot hole. The finished hole has a second surface condition, and the second surface condition is formed by transforming the first surface condition by the punch to have a precise dimension.
申请公布号 US8173933(B2) 申请公布日期 2012.05.08
申请号 US20080198506 申请日期 2008.08.26
申请人 TAKESHITA KENGO;HOSHIYAMA TAKASHI;DENSO CORPORATION 发明人 TAKESHITA KENGO;HOSHIYAMA TAKASHI
分类号 B23K26/00;B26D1/00 主分类号 B23K26/00
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