| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a connection structure of an electrode in an electronic part in which it is unnecessary to keep a gap between an upper electrode and a member to be joined in a space where capillarity occurs, and which can enhance joint strength of the member to be joined and the upper electrode. <P>SOLUTION: In the connection structure of electrode in the electronic part comprising a planar base member 11; a semiconductor device 12 as a member to be joined having a first electrode 13 and a second electrode 14; and an upper electrode 15 as a planar electrode oppositely arranged with a gap from the semiconductor device 12, the upper electrode 15 comprises a horizontal part 15A horizontally extending; and an inclined part 15B extending in an inclined manner with respect to the horizontal part 15A, and is arranged so that the horizontal part 15A and the inclined part 15B are opposed to the second electrode 14 of the semiconductor device 12 and a gap distance d between the inclined part 15B and the second electrode 14 becomes smaller as it is separated from the horizontal part 15A, and a solder is supplied to the gap between the upper electrode 15 and the second electrode 14 through a through hole 15c of the horizontal part 15A to perform solder joint. <P>COPYRIGHT: (C)2012,JPO&INPIT |
