发明名称 METHOD OF SPLITTING BRITTLE MATERIAL SUBSTRATE WITH RESIN
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of splitting brittle material substrate with a resin, which has high reliability and with which size accuracy is improved. <P>SOLUTION: The method of splitting a brittle material substrate with a resin which is made by sticking the resin to one principal surface of the brittle material substrate includes: a groove part forming process of forming a groove part on the predetermined position of splitting of the resin side of the brittle material substrate with the resin; a scribe line forming process of forming a scribe line on the predetermined position of the brittle material substrate side; and a breaking process of splitting the brittle material substrate with the resin along the scribe line (for example, the breaking process of splitting the brittle material substrate with the resin by energizing two positions symmetrical to the predetermined position, on the principal surface of the brittle material substrate and a position on the extension line of the scribe line, on the principal surface of the resin side, by the use of a prescribed energizing member). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012066479(A) 申请公布日期 2012.04.05
申请号 JP20100213157 申请日期 2010.09.24
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 TAKEDA MASAKAZU;MURAKAMI KENJI;HASHIMOTO TAICHI
分类号 B28D5/00;H05K3/00 主分类号 B28D5/00
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