发明名称 Multi-Die LED Package and Backlight Unit Using the Same
摘要 A multi-die LED package comprises a diode that works as a light-emitting diode for emitting light and as a sensing diode for detecting at least one physical quantity. The multi-die LED package is able to provide desired luminance and color independent of aging, temperature or other effects.
申请公布号 US2012063121(A1) 申请公布日期 2012.03.15
申请号 US201013320055 申请日期 2010.05.25
申请人 ATKINS ROBIN;DOLBY LABORATORIES LICENSING CORPORATION 发明人 ATKINS ROBIN
分类号 G09F13/04;H05B37/02 主分类号 G09F13/04
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