| 摘要 |
The present invention relates to a heat pump system for cooling and heating operations and hot water supply, wherein the heat pump system comprises a heat pump unit, a heat source unit, and a load unit, and further comprises a hot water supply heat exchanger in which heat exchange is performed between a refrigerant discharged from a compressor of the heat pump unit and a secondary fluid for providing hot water; and a temperature-raising heat exchanger in which heat exchange between a heat-source-side secondary fluid, which is fed from the heat source unit to a heat-source-side heat exchanger, and a cooling and heating secondary fluid, which has passed through the load unit and a load-side heat exchanger, is performed. The heat-source-side secondary fluid, the temperature of which has risen by means of the heat exchange between the load-side secondary fluid and the heat-source-side secondary fluid, raises an evaporation temperature of the refrigerant flowing through the heat pump system. As a result, the temperature at a compressor outlet and a condensing temperature are raised to supply hot water at a higher temperature for indoor heating or supplying hot water. |
