| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing easily and efficiently a highly reliable electronic device. SOLUTION: The method for manufacturing the electronic device includes a step of preparing an electronic module (a substrate 10) having a base substrate 12 and an electric connection 14 formed on the base substrate 12; a step of providing a resin 30 on the electronic module to cover therewith the electric connection 14; a step of so forming a wiring 34 on the resin 30 that at least its portion overlaps with the electric connection 14; and a step of pressing the wiring 34 against the electric connection 14 in the overlapping portion of the wiring 34 with the electric connecting portion 14, and approximating the electric connection 14 to the wiring 34 while deforming the resin material 30 to connect electrically the electric connection 14 with the wiring 34 by contacting both with each other. COPYRIGHT: (C)2008,JPO&INPIT
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